Integrated Computational Materials, Process and Product Engineering – IC-MPPE 2022

In this talk, the evolution of hybrid printed electronics for flexibles and wearables applications will be reviewed. Hybrid integration leverages the strengths of flexible and printed electronics to manufacture compliant and large-area electronics and silicon-based technologies for computation and signal communication. Here we will address the state-of-the-art ultra-thin-chip (UTC) development to comply with the flexibility of the printed substrates. Successful and reliable integration of the UTC to low Cost printed circuit boards such as PET either in a stop & go fabrication line via die-bonders or in a roll-to-roll line via in-line assembly modules are the most potent game-changer of printed hybrid electronics. Moreover, green electronics based on paper which have been considered as one of the emerging technologies will be assessed and the advancements and challenges in hybrid integration of UTCs on E-papers will be discussed.