Integrated Computational Materials, Process and Product Engineering – IC-MPPE 2022

Condition Monitoring (i.e. estimating a physical system's current fault state from accessible observations (sensor readings)) can sigificantly lower a systems' operating cost by facilitating longer service intervals and shorter service interventions. Model-Based Condition Monitoring (MBCM) uses inverse models to infer the current fault state. Constructing accurate, robust and compact inverse...

Induction hardening involves multiple physical problems from the electromagnetic, thermal, mechanical and metallurgical domain. These highly nonlinear coupled problems are usually solved by applying finite element methods (FEM) thanks to the available physics-based knowledge in the form of partial differential equations (PDEs). However, the material properties are coupled to the PDEs and they...

The manufacturing industries have already started to incorporate data driven and hybrid techniques into their associated material processes where utilization of physical and data-driven technologies along with Machine Learning (ML) and smart data handling have recently gained a tremendous momentum. Optimizing process controls through digital twining and improving operations and maintenances...

This lecture will highlight various sensors and sensor applications for wired and wireless CbM solutions Analog Devices provides in vibration monitoring. It will inform about trends and some practical use-cases our offerings fit into.

The present work investigates the technical feasibility of a condition monitoring setup aiming at the detection of RCF cracks, so called head checks, in railway rails via a wayside (i.e. stationary) setup using surface acoustic waves (SAW) as detection principle. The experimental SAW setup consists of a pitch-catch setup using piezo transducers equipped with comb adaptors to excite and measure...