International Conference on Thermo Mechanical Processing - TMP 2026

Operation conditions in microelectronics, sustainable mobility, and space exploration increasingly demand mastering thermal expansion due to large temperature swings and stringent dimensional tolerances. However, customizing thermal expansion of conventional metallic materials is extremely difficult. Their expansion behaviour is largely unaffected by alloying, and their lattice expansion...

Due to increasing operating temperatures in low-pressure turbine discs of next-generation geared turbofan engines, materials with superior high-temperature capabilities beyond those of alloy 718 are necessary. Among the promising candidates, UDIMET720LI offers excellent mechanical and environmental resistance properties; however, its narrow processing window poses significant challenges during...