International Conference on Thermo Mechanical Processing - TMP 2026

Session

Non-Ferrous Alloys (AI, Cu, Mg and Ti)

22 Oct 2026, 09:00

Austria Trend Parkhotel Schönbrunn

15. Tailoring thermal expansion of Titanium alloys by thermomechanical processing

Matthias Bönisch (KU Leuven)

22/10/2026, 09:00

Technology and Product Development in TMP

Oral Presentation

Operation conditions in microelectronics, sustainable mobility, and space exploration increasingly demand mastering thermal expansion due to large temperature swings and stringent dimensional tolerances. However, customizing thermal expansion of conventional metallic materials is extremely difficult. Their expansion behaviour is largely unaffected by alloying, and their lattice expansion...

67. Enhanced Mechanical and Electrical Properties of Cu-Based Alloys via TMCP Techniques

Eman El-Shenawy (Central Metallurgical R&D Institute (CMRDI))

22/10/2026, 09:20

Relevance of TMP and Microalloying to Sustainable Production of Steel and Nonferrous Alloys

Oral Presentation

Copper-based alloys are widely used in advanced electrical, thermal, and structural applications because of their excellent electrical conductivity, thermal transport, and corrosion resistance. However, their industrial applications are often limited by the traditional trade-off between mechanical strength and electrical conductivity, in which conventional strengthening methods may reduce...

65. Modeling of the production process of a UDIMET720LI turbine disc using a multi-class grain size model and a multi-scale mean-field approach

Drazen Brescakovic (Materials Center Leoben Forschung GmbH)

22/10/2026, 09:40

Technology and Product Development in TMP

Oral Presentation

Due to increasing operating temperatures in low-pressure turbine discs of next-generation geared turbofan engines, materials with superior high-temperature capabilities beyond those of alloy 718 are necessary. Among the promising candidates, UDIMET720LI offers excellent mechanical and environmental resistance properties; however, its narrow processing window poses significant challenges during...