26–29 Jun 2017
Austria Center Vienna
Europe/Vienna timezone

Numerical Simulation of turbulent Steel CEM® mold under high mass flow condition

28 Jun 2017, 14:20
20m
Room N (Austria Center Vienna)

Room N

Austria Center Vienna

Bruno-Kreisky-Platz 1 1020 ViennaAustria
Oral Presentation Thin slab casting and direct rolling Numerical simulation I

Speaker

Mr Jong-Yeon Hwang (POSCO)

Description

POSCO CEM® process can continuously produce coils without cutting before the finishing mill. Material balance with high throughput between the casting and rolling is essential to achieve this process. Throughput of CEM® has boasted a world-class level in the casting area. This was achieved with a high-speed casting technology and increased slab thickness up to 100 mm. Recently, many steel making companies are consistently requiring that higher throughput caster should be manufactured for this kind of directly linked process. To accomplish this high throughput casting, a lot of advanced technologies are required and the stability of meniscus in the mold is one of the important factors. EMBr, Electro Magnetic Braking system has come into the spotlight to control the mold level fluctuation. Therefore, the accurate evaluation of EMBr and some improvement of it, if necessary, are required. In this study, numerical study was carried out for more high throughput condition preparing the next generation of CEM®. The slab thickness is 110mm with slab width 1,600, 1,900mm. In order to effectively stabilize the meniscus, new SEN was designed. Mold flow using new SEN combined with U-shaped EMBr invented by POSCO was numerically evaluated for various external magnetic flux up to 0.35 T. Numerical results are consistently agreed with the plant results currently available by nail board test. Stabilized mold level is thought to make it possible to accomplish stable casting operation for high throughput case no one has ever carried out in the world.

Author

Co-authors

Prof. Brian G. Thomas (Colorado Scholl of Mines) Dr Myung Jong Cho (POSCO) Dr Seong-Mook Cho (University of Illinois at Urbana-Champaign)

Presentation materials