5th International Conference on Advances in Solidification Processes (ICASP-5) 5th International Symposium on Cutting Edge of Computer Simulation of Solidification, Casting and Refining (CSSCR-5)

Near eutectic Al-Cu droplets were rapidly solidified by Impulse Atomization. A wide range of microstructural scales was obtained at different cooling rates and undercoolings. The micrographs of the investigated samples revealed two distinct zones of different structural morphologies: An undulated eutectic morphology developed during recalescence following the single grain nucleation and a regular lamellar eutectic morphology resulting from the solidification of the remaining liquid post recalescence. The volume fraction of each zone was measured as a function of the droplet diameter, and the nucleation undercooling was deduced using the hypercooling limit equation. Scanning Electronic Microscopy imaging and microhardness measurements were used to evaluate the microstructural scale, and mechanical properties.