5th International Conference on Advances in Solidification Processes (ICASP-5) 5th International Symposium on Cutting Edge of Computer Simulation of Solidification, Casting and Refining (CSSCR-5)

A 3D mesoscopic envelope model is used to numerically simulate the experimental X-ray observations of the equiaxed dendritic isothermal solidification of a thin sample of Al-20 wt%Cu alloy including the natural convection flow. Several four-grain simulations are run to investigate the effect of the convection, of the grain position, and of the grain rotation on the tip growth kinetics of one of the grains. We show that the effect of convection flow – consequence of the presence of gravity parallel to the sample thickness direction, z – on the growth kinetics of the reference grain depends significantly on the position of the grain along the sample thickness.