Speaker
Description
FEBID is a direct nanolithography technique based on the local dissociation of adsorbates upon the irradiation with electrons, used for making 2D and 3D nanostructures.[1] CVD is a process where the volatile precursor is transported in the vapour carrier gas to the reactor chamber, decompose on a heated substrate and deposit a solid material.[2] The choice of the precursor is crucial for the success of CVD and FEBID: its chemical nature and dissociation behaviour determine the composition of the deposit.[3] So far copper(II) carboxylate [Cu2(µ–O2CC2F5)4] have been used in the FEBID process, but the purity (23 at.%) of the formed structures remains a problem.[4]
Here we report on our study of copper(II) amidine–carboxylate complexes with the general formula [Cu2(NH2(NH=)CC2F5)2(µ–O2CRF)4], where RF = CnF2n+1. The sublimation experiment carried out for [Cu2(NH2(NH=)CC2F5)2(µ–O2CC2F5)4] showed that it goes into the gas phase at 90oC without decomposition. Thermal analysis, mass spectrometry with electron impact ionization, and variable-temperature infrared spectroscopy were performed for these compounds. Copper films were deposited by CVD method with the evaporation temperature of 393 K and 453 K, respectively, and the decomposition temperature in the range of 573–633 K without the use of hydrogen. The microscopic observations made to investigate the interaction of the [Cu2(NH2(NH=)CC2F5)2(µ–O2CC2F5)4] with the electron beam showed that the ligands are almost entirely lost under TEM analysis conditions (200 keV), and the final product is CuF2.
References
[1] I. Utke and A. Gölzhäuser, Angewandte Chemie Int. Ed. 49 (2010) 9328-9330.
[2] T.T. Kodas, M.J. Hampden‐Smith, The Chemistry of Metal CVD; Wiley-VCH: Weinheim, Germany, 1994, 30.
[3] I. Utke, P. Hoffmann, J. Melngailis, J. Vac. Sci. Technol. B, 2008, 26, 1197–1276.
[4] L. Berger, J. Jurczyk, K. Madajska, T. E. J. Edwards, I. Szymańska, P. Hoffmann, I. Utke, ACS Appl. Electron. Mater., 2020, 2, 7, 1989–1996
| Speaker Country | Poland |
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