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Properties of the triple alloys belonging to the Cu-Zn-In system are not well known. This may results from the experimental troubles caused by the large differences in the melting temperatures ofcomponentsand Zn ability for intensive evaporation. There is also no ternary phase diagram available.In spite of that, the differences in the properties of components suggest that triple CuZnIn alloys could be promising for industrial applications, e.g.as a solders for welding of the cast iron.
The work concerns investigations of the diffusional formation of phases at the binary and ternary interfaces of Cu, Zn and In with participation of the liquid phase. The annealing of three different configurations of joints was performed at three increasing temperatures. The experiments revealed a complex diffusion paths of elements. It could be concluded that In reveals a preferential ability for diffusion in Zn followed by In-Zn eutectics formation, even at low temperatures. Ternary phases were formed at 350 and 450oC when annealed by500 and 700 hours. In the applied conditions pure Cu interface revealed to be a barrier for the diffusion of liquid In while the Zn diffusion proceededwith no restrictions. This lead to the formation of the binary phases from the Cu-Zn system, including this rich in Zn. The joint diffusion of Zn/In in Cu or Cu/In in Zn took placeat the respectfully high temperatures, leading to the formation of ternary phases. The content of In in them was up to 20at% while proportion of Cu:Zn was related to the specific phases from the Cu-Zn system, from Cu(Zn) solid solution to the phase, containing 67 at.% of Zn. Surprisingly, in the applied conditions binary phases from the Cu-In system werenot detected.
Acknowledgement: The work was realized as statutory project of IMMS PAS in Krakow in years 2020 in the Accredited Laboratories of IMIM PAS.
| Speaker Country | Poland |
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