Mr
Material Center Leoben
Author in the following contributions
- Multi-Scale Atomistic Modelling of Point Defects in Cu Grain Boundaries and Triple Junctions
- Influence of segregation on the adhesion of the Cu-WTi Interface
- Multi-Scale Modelling of the Clustering Processes and Mobility Properties of Vacancies in Cu
- Locally resolved interfacial fracture mechanics in a Si-WTi-Cu multilayer system
- Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites