Integrated Computational Materials, Process and Product Engineering – IC-MPPE 2022

In recent years, 3D integration technology plays an important role with respect to improved functionality and miniaturization of microelectronic devices. Through Silicon Via (TSV) technology enables electrical connection through the different layers of the 3D stacks. Those metallized vertical vias are introduced by etching holes into the silicon. The holes are then either coated or filled with a conductive material – open or closed TSVs are achieved, respectively. A major challenge concerns the time- and cost- efficient inspection of the TSVs (i.e., 10,000 TSVs/wafer) with respect to their quality. Therefore, the presented research:

1. Gains information about TSVs using the concept of Scanning Acoustic
   Microscope (SAM) interferometry.
2. Localizes and Classifies automatically the TSVs with high efficiency and
   accuracy by developing and applying two interconnected Convolutional Neural
   Networks (CNN).
3. Helps to understand the propagation of acoustic waves and its interaction
   with the TSVs using Elastodynamic Finite Integration (EFIT) based simulation.