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Integrated Computational Materials, Process and Product Engineering – IC-MPPE 2022

Name: Integrated Computational Materials, Process and Product Engineering – IC-MPPE 2022
Start: 2022-05-05T07:30:00+02:00
End: 2022-05-06T19:00:00+02:00
Location: Live Congress Leoben

5–6 May 2022 Hybrid conference

Live Congress Leoben

Europe/Vienna timezone

Conference Secretary

Virtual warpage analysis as major tool for “Design for Reliability” for PCBs and IC-substrates

6 May 2022, 09:55

20m

Peter Tunner Saal - Room 2

Oral Presentation Energy storage for e-mobility and stationary applications Reliability of electronic based systems

Mr Thomas Krivec (AT&S)

....

Speaker Country	Austria

Mr Thomas Krivec (AT&S)

ICMPPE2022-VirtualWarpageAnalysis_v01.pptx

Integrated Computational Materials, Process and Product Engineering – IC-MPPE 2022

Conference Secretary

Virtual warpage analysis as major tool for “Design for Reliability” for PCBs and IC-substrates

Peter Tunner Saal - Room 2

Speaker

Description

Author

Presentation materials