5–6 May 2022 Hybrid conference
Live Congress Leoben
Europe/Vienna timezone

Session

Reliability of electronic based systems

6 May 2022, 09:55
Peter Tunner Saal - Room 2

Peter Tunner Saal - Room 2

Conveners

Reliability of electronic based systems

  • Elke Kraker (Materials Center Leoben Forschung GmbH)

Presentation materials

There are no materials yet.

  1. Mr Thomas Krivec (AT&S)
    06/05/2022, 09:55
    Energy storage for e-mobility and stationary applications
    Oral Presentation
  2. Mrs Genevieve Martin (Signify)
    06/05/2022, 10:15
    Energy storage for e-mobility and stationary applications
    Oral Presentation

    The European industry needs to keep competitive advantage by addressing the needs for Industry 4.0 and be prepared for 5.0.

    Already finalized European project Delphi4LED proposed new methods and standards to generate a first of a kind multi-domain LED digital twins. Compared to traditional approach, the newly developed LED digital models contributes to reduce the design phase thanks to...

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  3. Julien Magnien (Materials Center Leoben Forschung GmbH (MCL))
    06/05/2022, 10:35
    Energy storage for e-mobility and stationary applications
    Oral Presentation

    Remaining useful life (RuL) model for electronic systems, e.g. for power electronics, deals with the prediction of possible service life and failures under different types of operating conditions. It is almost impossible to precisely predict future events; therefore, it is necessary to account for the different sources of uncertainty that affect lifetime estimations. Beside the RuL modelling...

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  4. Lisa Mitterhuber
    06/05/2022, 10:55
    Energy storage for e-mobility and stationary applications
    Oral Presentation

    Energy efficiency and saving in microelectronic devices goes along with thermal management, as their failure rate increases exponentially and their efficiency decreases linearly with the operating temperature. Due to the continuous trend of miniaturization, thermal management additionally gains importance and leads to an increase in device packing density. This triggers the need for heat...

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