Speaker
Martin Dopler
(Metalpine GmbH)
Description
Nowadays, Copper alloys are widely used in additive manufacturing applications. Generally spoken, a higher thermal and electrical conductivity goes hand in and with a lower yield strength. Hence, a lot of efforts are being undertaken to improve mechanical properties of copper alloys, e.g. by improving dispersion strengthening or aging mechanisms, by chosing the right heat treatment and of course also by adding more and more expensive alloying elements such as silver, chromium and niobium. In this presentation, an overview is given over experiences and trends in laser powder bed fusion of copper alloys targetting high electrical and thermal conductivity as well as high strength alloys e.g. for mould inserts.
| Speaker Country | Austria |
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Author
Martin Dopler
(Metalpine GmbH)
Co-authors
Alexander Walzl
(DISTECH Disruptive Technologies GmbH)
Clemens Cislo
(Metalpine GmbH)
Anna Köll
(Metalpine GmbH)