EUROPEAN CONGRESS AND EXHIBITION ON ADVANCED MATERIALS AND PROCESSES - EUROMAT 2021

Abstract: The surface tension of liquid iron copper binary alloys containing 0.25 mass %, 0.75 mass %, 1.0 mass % and 2.5 mass % of copper has been investigated in the temperature range 1575 °C to 1650 °C in steps of 25 °C using the sessile drop method (SD). The sessile-drop experiments in a heating microscope have been conducted in Argon atmosphere at low oxygen partial pressure (up to 〖P_(O_2 )=10〗^(-22) bar). The sintered Al2O3 ceramic was applied as substrate. The results indicate that the surface tension of binary iron-copper increases with increasing of temperature. The kinetic of copper evaporation (1.0 mass % as an example) under the experimental pressure (1 bar) was discussed. In order to deeply study copper evaporation process, parameters such as vapor pressure of pure copper and the copper diffusion in the Ar atmosphere D_(Cu-Ar) at the present experimental conditions were calculated and those influence on the evaporation process was discussed.

Keywords: Fe-Cu System, Al2O3, Surface tension, Diffusion, Copper evaporation